Cooling of ultrasound energizers mounted on printed circuit boards

ABSTRACT

An assembly including:a printed circuit board (PCB) having a first surface and a second surface;at least one energy transmitter mounted on the first surface;at least one cooling element associated with the PCB second surface, wherein the cooling element is configured to cool the at least one energy transmitter via the PCB.

RELATED APPLICATIONS

This application is a Continuation of PCT Patent Application No.PCT/IL2021/051558 having International filing date of Dec. 30, 2021,which claims the benefit of priority under 35 USC §119(e) of U.S.Provisional Pat. Application No. 63/132,629 filed on Dec. 31, 2020. Thecontents of the above applications are all incorporated by reference asif fully set forth herein in their entirety.

FIELD AND BACKGROUND OF THE INVENTION

The present invention, in some embodiments thereof, relates to an energytransmitting assembly and, more particularly, but not exclusively, to anultrasound energy transmitting assembly.

SUMMARY OF THE INVENTION

The following describes some examples of embodiments of the invention(an embodiment may include features from more than one example and/orfewer than all features of an example):

Example 1. An assembly comprising:

-   a printed circuit board (PCB) having a first surface and a second    surface;-   at least one energy transmitter mounted on said first surface;-   at least one cooling element associated with said PCB second    surface, wherein said cooling element is configured to cool said at    least one energy transmitter via said PCB.

Example 2. An assembly according to example 1, comprising at least onetemperature sensor mounted on said first surface of said PCB near saidat least one energy-transmitter.

Example 3. An assembly according to example 2, wherein said at least oneenergy transmitter comprises a plurality of spaced-apart energytransmitter mounted on said first surface of said PCB, and wherein saidat least one temperature sensor comprises at least two temperaturesensors, wherein a single or at least one temperature sensor of said atleast two temperature sensors is mounted between two adjacent energytransmitters on said first surface.

Example 4. An assembly according to any one of examples 2 or 3, whereinsaid at least one temperature sensor comprises a thermistor.

Example 5. An assembly according to any one of the previous examples,wherein said PCB comprises at least one heat conducting region betweensaid at least one cooling element and said at least one energytransmitter.

Example 6. An assembly according to example 5, wherein said at least oneheat conducting region crosses said first surface on which said at leastone energy transmitter is mounted.

Example 7. An assembly according to example 5, wherein a PCB region ispositioned between said at least one energy transmitter and said atleast one heat conducting region.

Example 8. An assembly according to any one of examples 5 to 7, whereinsaid at least one heat conducting region is aligned with a position ofsaid at least one energy transmitter on said first surface.

Example 9. An assembly according to any one of examples 5 to 8, whereinsaid at least one heat conducting region comprises an implant of a heatconducting material inside the PCB.

Example 10. An assembly according to any one of examples 5 to 9, whereinsaid at least one heat conducting region comprises a via channelpreformed in the PCB, wherein at least 50% of a volume of said viachannel is filled with a heat conducting material.

Example 11. An assembly according to any one of examples 9 or 10,wherein said heat conducting material comprises at least one of Copper,Gold, Silver, Silver Epoxy and Gold Epoxy.

Example 12. An assembly according to any one of the previous examples,wherein said at least one cooling element comprises a flat surface, andwherein said flat surface is at least partly attached to said secondsurface of said PCB.

Example 13. An assembly according to any one of the previous examples,wherein said PCB comprises at least one cavity with an opening in saidsecond surface, wherein said at least one cavity is aligned with said atleast one energy transmitter, and crosses at least partly said PCB, andwherein said cooling element is shaped and sized to penetrate throughsaid opening into said at least one cavity.

Example 14. An assembly according to example 13, wherein said at leastone cooling element comprises a heat-conducting holder having at leastone protrusion, and wherein said at least one protrusion is shaped andsized to penetrate through said opening into said at least one cavity.

Example 15. An assembly according to any one of examples 1 to 12,wherein said at least one cooling element comprises a heat conductingholder having a flat surface, and wherein said holder flat surface is incontact with said second surface.

Example 16. An assembly according to any one of examples 1 to 11,wherein said at least one cooling element comprises one or more coolingchannels passing through said PCB.

Example 17. An assembly according to example 16, wherein said one ormore cooling channels comprise at least inlet and/or at least one outletat said second surface of said PCB.

Example 18. An assembly according to any one of the previous examples,wherein said at least one energy transmitter comprises at least onefirst electrode and at least one second electrode for deliveringelectricity from said PCB to said at least one energy transmitter.

Example 19. An assembly according to example 18, wherein said PCBcomprises at least one flexible region for electrically connecting saidat least one first electrode to a first electrically conducting pad ofthe PCB, and wherein said at least one second electrode is electricallyconnected to a second electrically conducting pad of the PCB via anelectrically conducting adhesive layer.

Example 20. An assembly according to example 18, wherein said PCBcomprises at least two flexible regions, wherein at least one flexibleregion electrically connects said at least one first electrode to saidPCB, and wherein a different flexible region of said at least twoflexible regions electrically connects said at least one secondelectrode to said PCB.

Example 21. An assembly according to example 18, wherein said at leastone first electrode is electrically connected by wire welding to a firstelectrically conducting pad of the PCB and wherein said at least onesecond electrode is electrically connected to a second electricallyconducting pad of the PCB via an electrically conducting adhesive layer.

Example 22. An assembly according to example 18, wherein each of said atleast one first electrode and said at least one second electrode iselectrically connected to said PCB by a different electricallyconducting pad of the PCB, via an electrically conducting adhesivelayer.

Example 23. An assembly according to any one of the previous exampleswherein said PCB comprises at least one thermal insulating regionbetween said at least one cooling element and at least one region of thefirst surface adjacent to said at least one energy transmitter.

Example 24. An assembly according to example 23, wherein said at leastone thermal insulating region crosses said first surface.

Example 25. An assembly according to example 23, wherein at least onelayer of said PCB is positioned between said first surface and said atleast one thermal insulating region.

Example 26. An assembly according to example 23, wherein said at leastone thermal insulating region is spaced apart from each of said firstsurface and said second surface of said PCB by at least one layer ofsaid PCB.

Example 27. An assembly according to any one of examples 23 to 26,wherein said at least one thermal insulating region is an opening in thePCB filled with air.

Example 28. An assembly according to any one of examples 23 to 26,wherein said at least one thermal insulating region comprises an implantof a thermal insulating material inside the PCB.

Example 29. An assembly according to any one of examples 23 to 26,wherein said at least one thermal insulating region comprises a viapreformed in the PCB filled with a thermal insulating material.

Example 30. An assembly according to any one of examples 28 or 29,wherein said thermal insulating material comprises air or gas or silicaparticles with air.

Example 31. An assembly according to any one of examples 2 to 4,comprising at least one thermal insulating region between said at leastone temperature sensor on said first surface and said at least onecooling element.

Example 32. An assembly according to any one of the previous examples,wherein said at least one energy transmitter comprises at least one of,at least one ultrasound transducer, at least one radiofrequencyelectrode, and at least one laser diode.

Example 33. An assembly according to example 32, wherein said at leastone ultrasound transducer is configured to deliver unfocused ultrasoundenergy.

Example 34. An assembly according to any one of examples 31 or 32,wherein said at least one ultrasound transducer comprises at least onepiezoelectric element.

Example 35. A printed circuit board (PCB), comprising:

-   a rigid region having a first surface and a second surface, wherein    said rigid region comprises one or more cavities crossing through    said second surface;-   at least one energy transmitter positioned on said first surface,    and wherein said one or more cavities is aligned with a position of    said at least one energy transmitter.

Example 36. A PCB according to example 35, comprising:

a flexible region electrically and mechanically connected to said rigidregion second surface at a distance from an edge of said rigid region.

Example 37. A PCB according to any one of examples 35 or 36, whereinsaid rigid region comprises at least one heat conducting region betweensaid one or more cavities and said at least one energy transmitter.

Example 38. A PCB according to any one of examples 35 to 37, whereinsaid at least one energy transmitter comprises a plurality of energytransmitters positioned on the first surface at a distance between eachother, and wherein said one or more cavities comprise a plurality ofspaced-apart cavities arranged side-by-side within said rigid region,wherein each cavity of said plurality of spaced-apart cavities isaligned with a different energy transmitter of said plurality of energytransmitters.

Example 39. A PCB according to any one of examples 35 to 38, whereinsaid first surface and/or said second surface are planar.

Example 40. A PCB according to any one of examples 35 to 39, whereinsaid one or more cavities is shaped and sized to receive at least onecooling element.

Example 41. An ultrasound applicator comprising:

-   at least one energy emitting assembly, comprising:-   a printed circuit board (PCB) having a first surface and a second    surface;-   at least one ultrasound transducer mounted on said first surface;-   at least one rigid cover having an opening and configured to    geometrically interlock with said PCB, wherein said at least one    ultrasound transducer and said PCB first surface are at least partly    exposed via said opening of said at least one rigid cover.

Example 42. An applicator according to example 41, wherein said PCBcomprises at least one recess, and wherein said at least one rigid covergeometrically interlocks with said at least one recess.

Example 43. An applicator according to any one of examples 41 or 42,wherein said at least one energy emitting assembly comprises at leastone cooling element associated with said PCB second surface, whereinsaid at least one cooling element is configured to cool said at leastone ultrasound transducer via said PCB.

Example 44. An applicator according to any one of examples 41 to 43,comprising at least one insulating layer attached to said cover distallyto said opening, wherein said at least one insulating layer electricallyisolates said at least one energy emitting assembly and seals the atleast one energy emitting assembly from penetration of humidity andliquids.

Example 45. A method for cooling an energy transmitter, comprising:

providing at least one energy transmitter mounted on a surface of aprinted circuit board (PCB); cooling said at least one energytransmitter and/or said surface via said PCB.

Example 46. A method according to example 45, wherein said coolingcomprises cooling said at least one energy transmitter and/or saidsurface by at least one cooling element penetrating at least partly intosaid PCB via a different surface of said PCB.

Example 47. A method according to any one of examples 45 or 46, whereinsaid providing comprises providing at least one ultrasound transducermounted on said surface, and wherein said cooling comprises cooling saidat least one ultrasound transducer and/or said surface via said PCB.Example 48. A method according to example 47, comprising activating saidat least one ultrasound transducer to generate and deliver unfocusedultrasound energy to a skin tissue during said cooling.

Example 49. A method for manufacturing an energy transmitting assembly,comprising: providing a rigid printed circuit board (PCB) havingelectrical wiring, a first surface and a second surface;

and mounting at least two ultrasound transducers on said first surfaceat a distance from each other. Example 50. A method according to example49, comprising forming at least two cavities in said PCB, wherein eachcavity has an opening in said second surface.

Unless otherwise defined, all technical and/or scientific terms usedherein have the same meaning as commonly understood by one of ordinaryskill in the art to which the invention pertains. Although methods andmaterials similar or equivalent to those described herein can be used inthe practice or testing of embodiments of the invention, exemplarymethods and/or materials are described below. In case of conflict, thepatent specification, including definitions, will control. In addition,the materials, methods, and examples are illustrative only and are notintended to be necessarily limiting.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

Some embodiments of the invention are herein described, by way ofexample only, with reference to the accompanying drawings. With specificreference now to the drawings in detail, it is stressed that theparticulars shown are by way of example and for purposes of illustrativediscussion of embodiments of the invention. In this regard, thedescription taken with the drawings makes apparent to those skilled inthe art how embodiments of the invention may be practiced.

In the drawings:

FIG. 1 is a schematic illustration of an energy transmitting assemblywhich includes at least one energy transmitter positioned on a surfaceof a PCB, according to some exemplary embodiments of the invention;

FIG. 2 is a general flow chart for cooling at least one energytransmitter via the PCB, according to some exemplary embodiments of theinvention;

FIG. 3A is a schematic illustration of a PCB, according to someexemplary embodiments of the invention;

FIGS. 3B-3E are schematic illustrations of a PCB within an applicatorbody, according to some exemplary embodiments of the invention;

FIG. 3F is a schematic illustration of a connection between a flexibleregion and a rigid region of a PCB, according to some exemplaryembodiments of the invention;

FIGS. 4A-4G are schematic illustrations of a PCB with at least onecavity, according to some exemplary embodiments of the invention;

FIGS. 5A-5F are schematic illustrations of a heat conducting holderhaving a plurality of extensions shaped as fingers, placed withincavities of a PCB, according to some exemplary embodiments of theinvention;

FIGS. 6A-6B are schematic illustrations showing a PCB having a flatsurface placed on top of a holder extensions, according to someexemplary embodiments of the invention;

FIGS. 7A-7C are schematic illustrations of a PCB having at least oneheat conducting region and/or at least one thermal insulating region,positioned on a holder extensions, according to some exemplaryembodiments of the invention;

FIG. 8A is a schematic illustration of a PCB having a flat surfacepositioned on a flat surface of a holder, according to some exemplaryembodiments of the invention;

FIGS. 8B-8D are schematic illustrations of a PCB having a flat surfaceand at least one heat conducting region and/or at least one thermalinsulating region, positioned on a flat surface of a holder, accordingto some exemplary embodiments of the invention;

FIG. 9A is a schematic illustration of a PCB having an inner coolingelement, according to some exemplary embodiments of the invention;

FIGS. 9B-9C are schematic illustrations of a PCB having an inner coolingelement and at least one heat-conducting element between the innercooling element and a PCB surface on which energy transmitters aremounted, according to some exemplary embodiments of the invention;

FIGS. 10A-10C are schematic illustrations showing cross section views ofenergy transmitters mounted on a PCB with an inner cooling element,according to some exemplary embodiments of the invention;

FIGS. 11A-11F are schematic illustrations of an assembly process of anapplicator head comprising a PCB with energy transmitters mounted on aPCB surface, according to some exemplary embodiments of the invention;

FIGS. 11G-11H are schematic illustrations showing a flexible region of aPCB attached to a holder, according to some exemplary embodiments of theinvention;

FIGS. 12A-12F are schematic illustrations showing electrical connectionsbetween a PCB and an energy transmitter on the PCB, according to someexemplary embodiments of the invention;

FIGS. 13A-13C are schematic illustrations showing an electricallyisolated region surrounding electrical connectors of the PCB, accordingto some exemplary embodiments of the invention;

FIGS. 14A-14C are schematic illustrations of an applicator comprisingone or more units of an energy transmitting assembly, according to someexemplary embodiments of the invention;

FIG. 15 is a schematic illustration of an energy transmitting assemblycomprises at least two different types of energy transmitters on a PCBsurface, according to some exemplary embodiments of the invention; and

FIGS. 16A-16F are schematic illustrations of PCB wiring and layers,according to some exemplary embodiments of the invention.

DESCRIPTION OF SPECIFIC EMBODIMENTS OF THE INVENTION

The present invention, in some embodiments thereof, relates to an energytransmitting assembly and, more particularly, but not exclusively, to anultrasound energy transmitting assembly.

Overview

An aspect of some embodiments relates to an energy transmitting assemblywhich includes one or more energy transmitters mounted on a circuitboard, for example a printed circuit board (PCB), and cooling of the oneor more energy transmitters via the circuit board. In some embodiments,the one or more energy transmitters are mounted on a flexible region ofthe PCB, for example a flexible PCB, and/or on a rigid region of thePCB, for example a rigid PCB. In some embodiments, the one or moreenergy transmitters comprise one or more energy transducers, for exampleone or more ultrasound transducers. In some embodiments, the one or moreenergy transmitters are mounted on a first surface of the circuit board,and the cooling is applied via a second surface of the circuit board.Alternatively or additionally, the cooling is applied from within thecircuit board. In some embodiments, the circuit board compriseselectrical wiring, configured to deliver electric power to the one ormore energy transmitters and to electrically connect the one or moreenergy transmitters with a power source and/or a control circuitry.

According to some embodiments, cooling is provided by at least onecooling element associated with the second surface of the PCB. In someembodiments, the cooling element is attached to the second surface ofthe PCB, and heat is conducted from the one or more energy transmittersto the cooling element via the second surface of the PCB. Alternatively,heat is conducted from the one or more energy transmitters to a coolingelement positioned within the PCB.

According to some embodiments, the cooling element positioned within thePCB comprises at least one finger of a heat-conducting holder attachedto the second surface of the PCB. In some embodiments, the at least onefinger penetrates into the PCB. Optionally, the at least one finger, forexample a long axis of at least one finger is aligned with a location ofan energy transmitter mounted on the first surface. Alternatively, thecooling element positioned within the PCB comprises at least one channelshaped and sized to allow coolant fluid flow within the PCB.

According to some embodiments, the PCB comprises one or more heatconducting inserts between at least some of the energy transmitters oreach of the energy transmitters and the cooling element. In someembodiments, the heat conducting inserts are formed from a heatconducting material, and are optionally shaped and sized to conduct heatonly from the energy transmitters to the cooling element.

According to some embodiments, the energy emitting assembly comprisesone or more sensors mounted on the first surface of the circuit board,for example the PCB. In some embodiments, the one or more sensors arepositioned between adjacent energy transmitters. In some embodiments,the one or more sensors comprise a plurality of sensors and each of theplurality of sensors is positioned between two adjacent energytransmitters at the first surface of the circuit board. In someembodiments, the one or more sensors comprise at least one temperaturesensor, for example a thermistor. Alternatively, or additionally, theone or more sensors comprise at least one pressure sensor.

According to some embodiments, the circuit board comprises one or moreheat isolating regions, between the one or more sensors and the at leastone cooling element. In some embodiments, the one or more isolatingregions comprise an isolating material configured to thermally isolatethe one or more sensors from the cooling module, for example air,Nitrogen gas, gas filled small polymer particles, gas filled smallsilica particles, and glass fibers.

According to some embodiments, the one or more energy transmitterscomprise a single type of energy transmitting, for example ultrasoundtransducers. Alternatively, the one or more energy transmitters comprisea mic of two or more types of energy transmitters arranged at the firstsurface of the circuit board.

A potential advantage of mounting one or more energy transmitters on acircuit board, and most importantly in a planar geometry, may be toallow easy assembly and/or mass production of an energy transmittingassembly, for example using a pick and place method and/or machine,which are very common and standard in the PCB manufacturing industry.

An aspect of some embodiments relates to controlling heat conductivityvia a PCB, using at least one heat conducting region within the PCB. Insome embodiments, at least one heat conducting region is positionedbetween at least one cooling element associated with the PCB and asurface of the PCB on which at least one energy transmitter is mounted.In some embodiments, the heat conducting region is configured toincrease heat conductivity between the energy transmitter and thecooling element, which optionally allows efficient cooling of the energytransmitter by the cooling element. In some embodiments, the heatconducting region is selectively positioned within the PCB, for exampleaccording to a position or a planned position of a heat generatingelement, for example an energy transmitter.

In some embodiments, at least one heat conducing region in a PCB is aregion that conducts heat with more than 20%, for example more than 40%,more than 50%, more than 60%, more than 80% or any intermediate, smalleror larger percentage value, of a heat conducting efficiency compared toother regions of the PCB.

According to some embodiments, the heat conducting region is positionedbetween a first surface of the PCB on which the energy transmitter ismounted, and a second surface associated with the cooling element. Insome embodiments, the heat conducting region comprises a channel, forexample a VIA channel filled with a heat conducting material, having anopening in the second surface. In some embodiments, at least 50% of theVIA channel, for example at least 70%, at least 80%, at least 90%, atleast 95% of the VIA channel is filled with the heat conductingmaterial. In some embodiments, a portion of the PCB is positionedbetween the VIA channel and the first surface of the PCB, for example toallow electric isolation between an energy transmitter mounted on thefirst surface and the heat conducting material within the VIA channel.Alternatively, the VIA channel crosses through the first surface and thesecond surface of the PCB.

According to some embodiments, the heat conducting region comprises animplant, for example an insert positioned within the PCB. In someembodiments, the implant comprises a heat conducting material. In someembodiments, a portion of the PCB separates between the implant and thefirst surface on which the transducer is mounted. Additionally oroptionally, a portion of the PCB separates between the second surface ofthe PCB and the implant. Alternatively, the implant crosses through thesecond surface and/or the first surface of the PCB.

According to some embodiments, the PCB comprises at least one thermallyisolated region. In some embodiments, a thermally isolated region in aPCB is a region that conducts heat with less than 20%, for example lessthan 40%, less than 50%, less than 60%, less than 80% or anyintermediate, smaller or larger percentage value, of a heat conductingefficiency compared to other regions of the PCB.

According to some embodiments, the at least one thermally isolatedregion is positioned between a second surface of the PCB and/or acooling element, and a region of the first surface which is adjacent ornear an energy transmitter. Optionally, the at least one thermallyisolated region is positioned between a second surface of the PCB and/ora cooling element, and a region of the first surface which is positionedbetween two adjacent energy transmitter, for example to prevent overcooling of the first surface which optionally contacts tissue.

According to some embodiments, a position of the at least one thermallyisolated region is determined according to a location of an energytransmitter and/or a location of at least one sensor, for example atemperature sensor, on a surface of the PCB. In some embodiments, the atleast one thermally isolated region is selectively positioned betweenthe at least one sensor and at least one cooling element. In someembodiments, a position of the thermally isolated region is aligned witha region on the first surface between two adjacent energy transmittersand/or with a position of a sensor on the first surface.

According to some embodiments, the at least one thermally isolatedregion is in contact with a surface on which the at least one sensor ispositioned and/or in contact with the at least one cooling element.Alternatively, the at least one thermally isolated region isspaced-apart from a surface on which the at least one sensor ispositioned and/or is spaced-apart from the at least one cooling element.

According to some exemplary embodiments, the at least one thermallyisolated region crosses through the first surface and/or the secondsurface of the PCB. In some embodiments, a portion of the PCB separatesbetween the at least one thermally isolated region and the first surfaceand/or the second surface of the PCB. In some embodiments, the at leastone thermally isolated region comprises a VIA channel filled with athermally isolating material. In some embodiments, the at least onethermally isolated region comprises an implant of a thermally isolatingmaterial.

A potential advantage of a PCB with at least one specific thermallyisolated region within the PCB body may be to control or limit a thermaleffect via the PCB body on thermally sensitive elements, for example atleast one temperature sensor mounted on a surface of the PZT.

A potential advantage of having heat-conductive regions and/or thermalinsulating regions, may be to control distribution of a cooling effectfrom at least one cooling element through the PCB layers. The thermalisolation regions in the PCB allow the cooling to be aligned with alocation of an energy transmitters, for example a piezoelectric element(PZT), and/or to be localized to a region in the PCB beneath and/or nearthe PZT. This may prevent cooling of PCB regions without PZT, that touchthe skin.

Controlling of the cooling effect is important, for example to preventtoo much cooling of the skin, which may decrease or even prevent adesired thermal effect generated by the PZT elements, in the tissue.

An additional potential advantage of the thermal isolation regions maybe to isolate the thermistors from the cooling effect, for example toallow the thermistors to be highly responsive to heat flow from theskin.

The assembly and applicator described herein are configured to allowmeasurements of the skin temperature in direct contact and relativelyvery close to a location on the skin surface through which the energy isapplied.

An aspect of some embodiments relates to a PCB, for example a rigidregion of a PCB, having a first surface which comprises at least oneenergy transmitter and at least one cavity which is aligned with aposition of the energy transmitter on the first surface. In someembodiments, the cavity has an opening in a second surface of the PCB,which optionally an opposite surface to the first surface. In someembodiments, a flexible region is electrically and mechanically coupledto the rigid region at a distance from an end of the rigid region.Optionally, the flexible region electrically and mechanically connectsthe rigid region which comprises the at least one energy transmitter,with at least one different rigid region.

According to some embodiments, the rigid region comprises a plurality ofspaced-apart energy transmitters, for example ultrasound transducers,mounted on the first surface, at a distance from each other. In someembodiments, the rigid region comprises a plurality of spaced-apartcavities selectively positioned within the PCB according to adistribution of the energy transmitters on the first surface. In someembodiments, each cavity is aligned with a position of an energytransmitter on the first surface. In some embodiments, a portion of thePCB separates between each cavity and the first surface. In someembodiments, a portion of the PCB between each cavity and a firstsurface of the PCB has a thickness value in a range between 50 µm - 300µm, for example 50 µm - 100 µm, 70 µm - 200 µm, 100 µm - 200 µm, 150µm - 300 µm or any intermediate, smaller or larger range of values.

In some embodiments, at least one or each surface of the first surfaceand the second of the PCB are planar.

According to some embodiments, the rigid region of the PCB comprises atleast one heat conducting region between the cavity and the firstsurface. In some embodiments, the heat conducting region is separatedfrom the cavity and/or from the first surface by a portion of the PCB.

An aspect of some embodiments relates to an ultrasound applicator whichcomprises a PCB with at least one energy transmitter mounted on asurface of the PCB, and a cover, for example a rigid cover, that isconfigured to geometrically interlock with the PCB. In some embodiments,the cover comprises an opening. In some embodiments, when the coverinterlocks with the PCB the at least one energy transmitter is exposedvia the cover opening. In some embodiments, the ultrasound applicatorcomprises at least one insulating layer attached to the cover forexample on top the cover opening. In some embodiments, the at least oneinsulating layer seals the PCB and/or the at least one energytransmitter from humidity and/or liquids.

According to some embodiments, the PCB comprises at least one recess,for example a recess positioned laterally from a location of the atleast one energy transmitter on the PCB. In some embodiments, the coveris configured to geometrically interlock, for example to contact, the atleast one recess. In some embodiments, the at least one recess is arecess in the surface on which the at least one energy transmitter ismounted. Alternatively, the at least one recess is a recess in adifferent surface of the PCB, for example a surface which is opposite tothe surface on which the energy transmitter is mounted.

An aspect of some embodiments relates to a method for manufacturing ofan energy transmitting assembly by mounting at least one energytransmitter, for example an ultrasound transducer on a surface of a PCB.In some embodiments, a plurality of energy transmitters are mounted on asurface of the PCB at distance from each other, for example using a pickand place process. In some embodiments, a distance, for example aminimal distance, between two adjacent energy transmitters on the PCB isin a range of 0.1 mm - 100 mm, for example, 0.5 mm - 20 mm, 1 mm - 10mm, or any intermediate, smaller or larger range of values. In someembodiments, a distance, for example a minimal distance between twoadjacent energy transmitters on the PCB is 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3mm, 3.5 mm, 4 mm or any intermediate, smaller or larger distance. Insome embodiments, at least some or all of the energy transmitters arepositioned in parallel. Alternatively or optionally, at least some ofthe energy transmitters are oriented in an angle or at a differentorientation relative to adjacent energy transmitters. Alternatively oroptionally a distance between adjacent energy transmitters is similar orvaries between energy transmitters on the PCB.

According to some embodiments, during the manufacturing process one ormore cavities are formed in the PCB, for example according to a plannedposition of the at least one energy transmitter. In some embodiments,the one or more cavities have an opening in a surface of the PCB whichis different and optionally opposite to a surface on which the at leastone energy transmitter is mounted or is planned to be mounted. In someembodiments, a portion of the PCB separates between the cavity and aplanned location of the at least one energy transmitter on the PCB.

According to some embodiments, the cavity is formed by drilling throughthe PCB. Alternatively, the cavity is formed by stacking PCB layers eachhaving an opening in a planned location of the cavity. In someembodiments, each cavity is aligned with a planned position or with alocation of an energy transmitter on the PCB surface. In someembodiments, the cavity is formed with dimensions selected to allowpenetration of at least one heating element, for example an extension ofa heat-conducting holder, into the cavity.

According to some embodiments, during the manufacturing process, atleast one heat conducting region is formed in the PCB. In someembodiments, the at least one heat conducting region is formed between asurface of the PCB on which at least one energy transmitter is plannedto be mounted, and a second surface of the PCB. Alternatively, the atleast one heat conducting region is formed between a surface of the PCBon which at least one energy transmitter is planned to be mounted and acavity or a planned location of a cavity in the PCB.

According to some embodiments, the at least one heat conducting regionis formed by placing or introducing a heat conducting implant into thePCB, for example into a void or an opening formed in the PCB.Alternatively, the heat conducting region is formed by generating a viachannel in the PCB and filling the via channel with a heat conductingmaterial.

According to some embodiments, the manufacturing process comprisesmounting at least one sensor, for example a temperature sensor on topthe surface on which the at least one energy transmitter is mounted. Insome embodiments, the temperature sensor is mounted between two adjacentenergy transmitters. In some embodiments, the temperature sensor ismounted using a pick and place process.

Before explaining at least one embodiment of the invention in detail, itis to be understood that the invention is not necessarily limited in itsapplication to the details of construction and the arrangement of thecomponents and/or methods set forth in the following description and/orillustrated in the drawings and/or the Examples. The invention iscapable of other embodiments or of being practiced or carried out invarious ways.

Exemplary Energy Transmitting Assembly

According to some exemplary embodiments, at least one energy transmitteris used to deliver energy to tissue of the body, for example during amedical treatment or a cosmetic treatment. In some embodiments, the atleast one energy transmitter comprises a transducer, for example anultrasound transducer. Optionally, the ultrasound transducer comprises apiezoelectric ceramic material, for example Lead Zirconate Titanate,Barium Titanate, or other materials exhibiting piezoelectric behaviors.Alternatively or additionally, the at least one energy transmittercomprises at least one of a radiofrequency (RF) electrode and/or a laserdiode.

According to some exemplary embodiments, the at least one energytransmitter is part of an energy transmitting assembly, which comprisesan electric circuitry and a cooling element, for example a cooler,configured to cool the at least one energy transmitter and/or the tissueof the body, before, during and/or after the activation of the at leastone energy transmitter. Reference is now made to FIG. 1 , depicting anenergy emitting assembly, according to some exemplary embodiments of theinvention.

According to some exemplary embodiments, an energy-transmittingassembly, for example assembly 102, comprises a circuit board, forexample PCB 104 having a first surface 106, and at least one additionalsurface, for example a second surface 108. In some embodiments, thesecond surface 108 is opposite to the first surface 106.

According to some exemplary embodiments, the assembly 102 comprises atleast one energy transmitter, for example at least two energytransmitters 110 and 112 mounted on the first surface 106. In someembodiments, the at least two energy transmitters 110 and 112 areattached to the first surface 106 or are embedded in the first surface106. In some embodiments, the at least two energy transmitter 110 and112 are spaced apart, for example distributed on the first surface 106.

According to some exemplary embodiments, the assembly 102 comprises atleast one cooling element 114, for example at least one cooler,associated with the second surface 108 of the PCB 104. In someembodiments, the at least one cooling element comprise at least one of athermoelectric cooler (TEC), a heat-conducting holder, a heat sink, anda coolant fluid or coolant fluid channels passing through the PCB 104 orplaced in contact with the PCB 104. In some embodiments, the at leastone cooling element comprises a passive cooling element and/or an activecooling element.

According to some exemplary embodiments, the cooling element 114 is atleast partly attached to the second surface 108. In some embodiments,the cooling element 114 is at least partly in contact with the secondsurface 108. Alternatively or additionally, the cooling element 114penetrates at least partly into the PCB 104, optionally through thesecond surface 108. In some embodiments, a penetration region of thecooling element 114 into the PCB 104 is aligned with a location of atleast one energy transmitter on the first surface 106 of the PCB 104.

According to some exemplary embodiments, the assembly 102 comprises atleast one sensor, for example at least two sensors 116 and 118, mountedon top the first surface 106 of the PCB 104. In some embodiments, the atleast one sensor comprises a temperature sensor, for example athermistor. In some embodiments, the at least one sensor is attached tothe first surface 106. In some embodiments, the at least one sensor ispositioned between two adjacent energy transmitter, for example energytransmitters 110 and 112. In some embodiments, each sensor of the atleast two sensors 116 and 118 is positioned between a pair of adjacentenergy transmitters, on the first surface 106.

According to some exemplary embodiments, the assembly 102 comprises atleast one heat-conducting region in the PCB, optionally between thecooling element 114 and the at least one energy transmitter, for exampleto increase heat conduction through the PCB from the at least one energytransmitter and the cooling module. In some embodiments, the assembly102 comprises at least one thermally-isolating region within the PCB,optionally, between the at least one sensor, for example a temperaturesensor, and the cooling element, for example to reduce interference toheat measurements by the at least one temperature sensor from thecooling module 114.

According to some exemplary embodiments, the assembly 102 is part of anenergy transmitting applicator, optionally used in medical and/orcosmetic procedures. In some embodiments, the assembly 102 is placedwithin a head of the applicator, such that the first surface 106 isoriented to face a body tissue. In some embodiments, the first surface106 is configured to be placed in direct or indirect contact with thetissue, for example with the skin. In some embodiments, the firstsurface 106 is adjacent to a skin contacting surface of the applicator.Optionally, the skin contacting surface of the applicator is positionedbetween the tissue, for example the skin or the skin surface, and thefirst surface 106 comprising the at least one energy transmitter.

Exemplary Process for Cooling Transmitters

According to some exemplary embodiments, a device for delivery of energyto a tissue, for example an applicator, comprises one or energytransmitters, for example energy-emitting transducers. In someembodiments, the one or more energy transmitters are mounted on asurface of a circuit board, for example a PCB, and are positioned insidethe applicator to face a skin contacting surface of the applicator. Insome embodiments, during the activation of the one or more energytransmitters, heat is generated and delivered to a tissue, for exampleskin, contacting the applicator’s skin contacting surface. In someembodiments, in order to prevent thermal damage to the tissue, the skincontacting surface of the applicator and/or at least one of the energytransmitters is cooled.

Reference is now made to FIG. 2 , depicting a method for cooling atleast one energy transmitter of an applicator, according to someexemplary embodiments of the invention.

According to some exemplary embodiments, an applicator with at least oneenergy transmitter is provided at block 202. In some embodiments, theapplicator comprises a surface that is shaped and sized to be placed incontact with tissue, for example with a skin. In some embodiments, theapplicator is mounted on a surface of a PCB placed adjacent to the skincontacting surface of the applicator. In some embodiments, the at leastone energy transmitter is positioned between the skin contacting surfaceof the applicator and the PCB.

According to some exemplary embodiments, the applicator is optionallyplaced in contact with the skin, at block 204. In some embodiments, atleast a portion of the skin contacting surface of the applicator isplaced in contact with the skin.

According to some exemplary embodiments, the at least one energytransmitter is activated at block 206. In some embodiments, activatingthe at least one energy transmitter generates and delivers energy fromthe at least one energy transmitter to the tissue. In some embodiments,the at least one energy transmitter comprises an ultrasound transducer.In some embodiments, activation of the ultrasound transducer generatesand delivers ultrasound energy, for example unfocused ultrasound energy,into tissue layers of the skin, for example into deep tissue layers ofthe skin. In some embodiments, activation of the at least one energytransmitter generates heat by the transmitter, that may lead to thermaldamage of the tissue contacting the applicator.

According to some exemplary embodiments, cooling of the at least oneenergy transmitter is applied through the PCB, at block 208. In someembodiments, cooling is applied through one or more layers of the PCBstructure. In some embodiments, cooling is applied through the one ormore layers of the PCB to the at least one energy transmitter mounter onthe PCB surface. In some embodiments, the cooling is applied through oneor more surfaces of the PCB, for example one or more surfaces that areopposite to the surface on which the at least one energy transmitter ismounted. In some embodiments, the cooling is applied at block 208before, during and/or after the activating at block 208. In someembodiments, the cooling is applied via the PCB and the at least oneenergy transmitter to cool the tissue contacting the applicator and/orthe at least one energy transmitter.

Exemplary General PCB

According to some exemplary embodiments, a PCB comprises at least oneflexible region and at least one rigid region. Optionally, at least oneflexible region of the PCB interconnects two rigid regions of the PCB,forming for example a PCB body formed from flexible and rigid regionsconnected to each other. In some embodiments, the at least one rigidregion of the PCB is used as a base for connecting the at least oneenergy transmitter and/or the at least one sensor to the PCB.Additionally or alternatively, the at least one region is used as a basefor one or more electric connectors between the PCB and electricalwiring from other features of an energy transmitting applicator orsystem.

Reference is now made to FIGS. 3A-F, depicting a PCB having flexible andrigid regions, according to some exemplary embodiments of the invention.

According to some exemplary embodiments, a PCB 302 comprises at leastone first rigid region 304 and at least one second rigid region 306,interconnected by at least one flexible region 308. In some embodiments,a flexible region of the PCB, for example the flexible region 308 isthin and formed from a flexible material allowing bending in at least 45degrees, for example at least 90 degrees, at least 180 degrees, or anyintermediate, smaller or larger angle without damaging electrical wiringin the flexible region and/or structure of the flexible region.

According to some exemplary embodiments, the energy transmitter ispositioned on a flexible PCB. In some embodiments, a thermal conductingregion, optionally comprising a thermal conductive implant positioned inthe flexible PCB adjacent and/or aligned with the energy transmitter,optionally beneath the energy transmitter, is used to mechanicallysupport the energy transmitter, for example to prevent damage to theenergy transmitter when the flexible PCB bends. Alternatively, theenergy transmitter is positioned on the flexible PCB with no additionalmechanical support.

According to some exemplary embodiments, the at least one first rigidregion 304 comprises at least one, for example at least two energytransmitters 310 and 312, mounted on a first surface of the rigid region304. In some embodiments, the at least one two energy transmitterscomprise at least two ultrasound transducers, optionally comprising PZT.In some embodiments, the at least one first rigid region 304 comprisesat least one sensor, for example a temperature sensor mounted on thefirst surface of the rigid region 304. In some embodiments, the at leastone temperature sensor comprises a thermistor, for example thermistors312 and 314. In some embodiments, each of the thermistors is positionedbetween two adjacent energy transmitters.

According to some exemplary embodiments, the at least one second rigidregion 306 comprise at least one electrical connector, for exampleelectrical connectors 316 and 318. In some embodiments, the electricalconnectors are configured to electrically connect the PCB 302 to one ormore external electrical networks. In some embodiments, the at least oneelectrical connectors, for example connectors 316 and 318 are surroundedby a barrier 320, forming an isolated region of the connectors 316 and318. In some embodiments, the barrier separates the electricalconnectors from other parts of the second rigid region, for example toallow selective sealing of the isolated region which includes theconnectors, using a sealing liquid or a sealing gel.

According to some exemplary embodiments, the at least one second rigidregion 306 comprises at least one indicator, for example indicators 322and 324 configured to generate a human detectable indication, forexample an audio and/or a visual indication. In some embodiments, the atleast one indicator generates an indication when an electricalconnection is established between the PCB 302 and external elements viathe at least one electric connector, for example connectors 316 and 318.Alternatively or additionally, the at least one indicator generates anindication when the at least one energy transmitter, for exampletransmitters 310 and 312 are activated.

According to some exemplary embodiments, the PCB 302 comprises at leastone additional flexible region, for example flexible region 326 coupledto the at least one second rigid region 306. In some embodiments, theflexible region comprises electrical wiring, electrically connected toelectrical wiring of the rigid region 308 and/or the rigid region 304.In some embodiments, the flexible region 326 comprises at least oneindicator, for example indicator 328 configured to generate at least onehuman detectable indication, for example an audio and/or a visualindication. Alternatively or additionally, the flexible region 326comprises at least one user interface 330 for receiving at least oneuser input signal. In some embodiments, the at least one user interface330 comprises a switch, a selector and/or a button, for receiving theuser input. In some embodiments, the at least one user interface 330 ispositioned in at least one of a rigid and a flexible region of the PCB302.

According to some exemplary embodiments, the PCB 302 comprises at leastone flexible region, for example a flexible strip 332 coupled to therigid region 304. In some embodiments, the flexible strip comprises atleast one temperature sensor, for example a thermistor 334 electricallyconnected to the wiring within the flexible strip 332.

According to some exemplary embodiments, when positioned within anapplicator body, flexible regions of the PCB 302 allow placing the rigidregions at different positions and/or orientation relative to eachother, and relative to other elements within the applicator body. Forexample, the flexible strip 332 allows to place the thermistor 334 incontact with one or more elements that are located close to the rigidregion 304, for example with one or more cooling elements.

According to some exemplary embodiments, the PCB 302 which comprisesflexible and rigid regions is used as an electrical hub of theapplicator body, for example to allow connection of electricalcomponents to a central electrical wiring of the PCB 302, while allowinga mechanically flexible interface between the electrical componentscoupled to the PCB 302 and other components within the applicator body,for example other electrical and/or non-electrical components.

According to some exemplary embodiments, for example as shown in FIGS.3B and 3C, the PCB is placed within an applicator body which comprises acover, for example cover 311, configured to prevent contact betweentissue and the PCB or with other components within the applicator body.In some embodiments, a rigid region of the PCB, for example region 304comprising the energy transmitters 312 and 314 is placed in contact withthe cover 311.

According to some exemplary embodiments, for example as shown in FIG.3D. the applicator body comprises at least one cooling element, forexample holder 340, that is placed in contact with the PCB, for examplewith a rigid region 304 comprising the energy transmitters, for exampleenergy transmitter 310. In some embodiments, the holder 340 is aheat-conductive holder, which optionally also provides mechanicalsupport to the PCB. In some embodiments, the holder 340 is used as abase for the rigid region 304 of the PCB. In some embodiments, theholder 340 contacts a surface of the PCB which is opposite to thesurface and/or is different from the surface on which the transmitter310 is mounted.

According to some exemplary embodiments, for example as shown in FIG.3D, a cover 344 of the applicator body covers at least part of the PCBrigid region, on which the transmitter 310 is mounted, without coveringthe transmitter 310. In some embodiments, for example as shown in FIG.3D, the cover 344 is coupled to a PCB surface comprising the transmitter310. Alternatively, for example as shown in FIG. 3E, the cover of theapplicator body, for example cover 346 is coupled to a surface of thePCB which is opposite to the side of the PCB comprising the transmitter310. In some embodiments, for example as shown in FIG. 3E, the PCB rigidregion 305 is used as part of the applicator body cover.

According to some exemplary embodiments, for example as shown in FIGS.3D and 3E, the cover 344 geometrically interlocks with the PCB, forexample with rigid region 304 of the PCB. In some embodiments, forexample as shown in FIG. 3D, the rigid region 304 comprises at least onedistal recess 311, for example a lateral distal recess, which is closerto a surface of the PCB on which the transmitter 310 is mounted. In someembodiments, the cover 344 geometrically interlocks with the at leastone distal recess 311.

According to some exemplary embodiments, for example as shown in FIG.3E, the rigid region 304 comprises at least one proximal recess 313, forexample a lateral proximal recess, which is closer to a surface of thePCB facing the at least one cooling element, for example holder 340. Insome embodiments, the cover 346 geometrically interlocks with the atleast one proximal recess 313.

According to some exemplary embodiments, for example as shown in FIG.3F, a flexible region 308 is coupled, for example mechanically andelectrically coupled, to a rigid region 304 at a distance from an end305, for example an edge, of the rigid region 304. A potential advantageof the coupling of the flexible region to the rigid region at a distancefrom an edge of the distal region may be to allow tension release whenbending the flexible region relative to the rigid region, for examplewhen adjusting the shape and/or a size of the PCB to be placed within anapplicator body.

Exemplary PCB With Cavities

According to some exemplary embodiments, during the activation of atleast one energy transmitter mounted on a PCB, for example an ultrasoundtransducer, heat is generated by the at least one energy transmitter. Insome embodiments, the generated heat may cause thermal damage to tissuelocated adjacent to the energy transmitter or that is placed in director indirect contact with the energy transmitter. In some embodiments,cooling of the at least one energy transmitter, is performed using atleast one cooling element which is associated with the PCB, for examplevia a surface of the PCB that is different from the surface on which theat least one energy transmitter is mounted.

According to some exemplary embodiments, the PCB is formed with one ormore cavities that allow, for example, penetration of the at least onecooling element into the PCB. In some embodiments, the one or morecavities are aligned with a location of the at least one energytransmitter on the surface of the PCB. Reference is now made to FIGS.4A-4G, depicting a PCB with cavities that are shaped and sized toreceive at least part of a cooling element, according to some exemplaryembodiments of the invention.

According to some exemplary embodiments, for example as shown in FIG.4A, a PCB 402 has a thickness 406 in a range between 0.5 mm - 3 mm, forexample 0.5 mm - 2 mm, 1 mm - 2 mm, 1.5 mm - 3 mm or any intermediate,smaller or larger range of values. Optionally, the PCB 402 is formedfrom layers, for example 3, 4, 5, 6, 7 layers or any larger number oflayers.

According to some exemplary embodiments, the PCB comprises at least onecavity 404. In some embodiments, the cavity 404 penetrates through oneor more layers of the PCB 402. In some embodiments, the cavity 404, forexample the cavity long axis, is aligned with a pad 408 for placement ofan energy transmitter, attached to a first surface 410 of the PCB 402.In some embodiments, a thickness 412 of the PCB between the cavity 404and the pad 408, or between the cavity 404 and the PCB surface 410 is ina range between 0.05 mm - 0.5 mm, for example between 0.1 mm - 0.2 mm,0.15 mm - 0.3 mm, 0.25 - 0.5 mm, or any intermediate, smaller or largerrange of values.

According to some exemplary embodiments, the cavity 404 is formed duringthe manufacturing process of the PCB by reducing the number of layers inspecific PCB regions aligned, for example, with a planned location of atleast one energy transmitter or with a pad for positioning the energytransmitter. Alternatively, the cavity is formed by drilling through thePCB after the PCB is manufactured.

According to some exemplary embodiments, a PCB comprises a plurality ofcavities. In some embodiments, the number of cavities is determinedaccording to the number of heat generating elements mounted on a surfaceof the PCB, for example according to the number of energy transmittersmounted on the PCB surface. In some embodiments, the cavities arespaced-apart within the PCB. In some embodiments, a distance between twoadjacent cavities is determined according to a distance between twoadjacent energy transmitters or other heat generating elements alignedwith the cavities.

According to some exemplary embodiments, for example as shown in FIG.4B, the cavity is shaped and sized to receive at least a portion of acooling element, for example to position the cooling element at a shortdistance from a heat generating element, for example from the energytransmitter. In some embodiments, the cooling element comprises aheat-conducting holder, for example a base holder, configured to conductheat away from the energy transmitter, optionally towards an additionalcooling element. In some embodiments, the holder is formed from aheat-conducting material, for example a heat-conducting metal orcomposition of metals, for example aluminum or any other metal.

According to some exemplary embodiments, the holder comprises at leastone protrusion, for example a finger 414 which is shaped and sized topenetrate at least partly into the PCB 402 via the cavity 404. In someembodiments, a distal end 416 of the finger 414 is placed in contactwith the PCB 402, or with at least one layer of the PCB on which the pad408 or an energy transmitter is mounted. In some embodiments, the finger414 penetrates into the PCB 402 through a surface 418 which is adifferent surface and optionally an opposite surface to the surface 410onto which the energy transmitter is mounted. In some embodiments, awidth of the finger, for example finger 414 is smaller than a width ofthe cavity 404, for example to allow easy insertion of the finger intothe cavity.

According to some exemplary embodiments, for example as shown in FIG.4C, a finger 420 has a distal end 422 that comprises at least oneopening 424. Optionally, when inserting the finger 420 into the cavity404, the at least one opening 424, optionally filled with air, ispositioned between the finger 420 and the PCB 402.

According to some exemplary embodiments, for example as shown in FIG.4D, a filler material 426, for example an electrically and/or thermallyconductive filler, is positioned in the cavity 404 and fills spacesbetween the finger 420 and/or the finger distal 422, for example opening424, and the cavity walls. In some embodiments, the finger 420 is pushedinto a cavity that contains the filler material. In some embodiments,the filler material comprises a glue, for example an epoxy glue, used tofix the finger 420 within the cavity 404, and/or to attach the finger420 to the PCB 202. In some embodiments, the glue is an electrically andthermally conductive glue comprising metal particles, for examplealuminum, silver and/or gold particles.

According to some exemplary embodiments, the filler material 426 is usedas an interface between the holder and/or the holder finger in order,for example, to increase an adherence, electrical and/or thermalconductivity between the holder and the PCB.

According to some exemplary embodiments, for example as shown in FIG.4E, the holder body 428 contacts the PCB 402, while at least one finger430 extending from the holder body 428 penetrates into the cavity 404 ofthe PCB 402. In some embodiments, the holder body 428 contacts thesurface 418 which is a different surface, and optionally an oppositefrom the surface 410 on which at least one energy transmitter ismounted. In some embodiments, a length of the finger 430 is shorter orequal to the length of the cavity 404, for example to allow contactbetween the holder body and the PCB. Alternatively, for example as shownin FIGS. 4B-4D, the length of the holder finger is larger than a length405 of the cavity 404.

According to some exemplary embodiments, for example as shown in FIG.4F, the holder finger 432 is configured to interlock with the PCB 434,for example via a snap-fit assembly. In some embodiments, the PCB 434comprises at least one protruding edge 434, for example a flexible edge,which is configured to penetrate into an opening 438, for example asnap-in area, in the finger 432. In some embodiments, the snap-fitassembly comprising the at least one protruding edge 434 of the PCB 434and the opening 438 in the finger 432, is a permanent snap-fit.Alternatively, the snap-fit assembly is a multi-use snap-fit. In someembodiments, the protruding edge 436 is formed from one of the layers ofthe PCB 434. In some embodiments, the protruding edge 436 protrudes intothe cavity 404 of the PCB 434.

According to some exemplary embodiments, a PCB, for example PCB 450comprises at least one cavity 452 that is shaped and sized to receive afinger 454 of a holder. In some embodiments, the finger 454 extends froma holder body 456 that comprises at least one electrical connector, forexample connectors 458 and 460 that are configured to contact at leastone electrical conductive pad, for example pads 462 and 464 of the PCB450, respectively. In some embodiments, the electrical connectors of theholder are coupled to the pads of the PCB, when the holder finger 454 isinserted into the cavity 452. In some embodiments, an adhesive material468, optionally the filler material 426 shown in FIGS. 4D and 4E, fillsthe cavity 452, and optionally an opening 468 at the distal end 466 ofthe finger 454, to glue together the finger 454 and the PCB 450. In someembodiments, the adhesive material 468 allows to maintain a stableelectrical connection between the holder and the PCB via the connectors458 and 460 and the pads 462 and 464, by fixing a position of the finger454 within the cavity 452. In some embodiments, electrical power isdelivered from the holder to one or more elements mounted on the PCB,via the connectors 458 and 468 of the holder.

Exemplary Holder Fingers in Cavity

Reference is now made to FIGS. 5A-5C, depicting a PCB and a holder,where extensions of the holder, for example fingers, penetrate intocavities formed within the PCB, according to some exemplary embodimentsof the invention.

According to some exemplary embodiments, a holder 502 comprises a holderbody 504 and a plurality of extensions, for example fingers 506 and 508,extending from the body 504. In some embodiments, for example as shownin FIG. 5B, each finger penetrates into the PCB 512 via a cavity in thePCB 512. In some embodiments, each cavity crosses at least 50% of thePCB, for example at least 60%, at least 80%, at least 90% of the PCB. Insome embodiments, each cavity or at least some of the cavities in a PCBcross the entire PCB.

According to some exemplary embodiments, for example as shown in FIG.5C, the PCB 512 comprises at least one energy transmitter, for examplean ultrasound transducer 516 mounted on a surface 518 of the PCB 512,for example by at least one pad 520 attached to the surface 518. In someembodiments, the PCB comprises at least one sensor, for example athermistor 522 for measuring temperature. In some embodiments, thethermistor 522 is mounted on a surface of the PCB, for example surface518. In some embodiments, for example as shown in FIG. 5C, a holderfinger 524 is aligned with the location of the ultrasound transducer 516on the surface 518, and is laterally spaced-apart from the thermistor522.

Reference is now made to FIGS. 5D and 5E, depicting a rigid region of aPCB with a plurality of openings shaped and sized to receive fingers ofa holder, according to some exemplary embodiments of the invention.

According to some exemplary embodiments, a PCB 550 comprises at leastone rigid region 552 and at least one flexible region 554 coupled to therigid region 552. In some embodiments, the flexible region 554 compriseselectrical wiring extending to the rigid region 552. In someembodiments, the rigid region 552 comprises at least two energytransmitters, for example at least two ultrasound transducers 556 and558 mounted on a first surface 560 of the rigid region 552. In someembodiments, the at least two ultrasound transducers, for exampletransducers 556 and 558 are spaced apart on the surface 560.

According to some exemplary embodiments, the rigid region 552 comprisesat least one sensor, for example thermistor 562 mounted on the surface560. In some embodiments, the thermistor 562 is configured to measuretemperature levels of tissue contacting directly or indirectly thesurface 560, and/or the transducers 556 and 558. In some embodiments,the thermistor 562 is positioned at a distance from heat conductingand/or heat generating elements, for example ultrasound transducers 556and 558, for example not to interfere with the temperature measurements.In some embodiments, a single thermistor, for example thermistor 562 ispositioned between two adjacent ultrasound transducers 556 and 558 onthe surface 560. In some embodiments, for example as shown in FIG. 5D,at least one electrical connection 564 between the thermistor 562 and/oran ultrasound transducer, and the electrical wiring of the PCB, ispresent on the surface 560.

According to some exemplary embodiments, for example as shown in FIG.5E, the rigid region 552 comprises a plurality of cavities, for examplecavity 566, penetrating into the rigid region 560 via a second surface568, which is opposite to the first surface 560 onto which theultrasound transducers and/or the thermistors are mounted. In someembodiments, the plurality of cavities end at a distance from the firstsurface 560.

According to some exemplary embodiments, for example as shown in FIG.5F, the rigid region 552 of the PCB is positioned on top of a holderbody 570, for example a heat-conducting holder body, such thatprotrusions, for example fingers extending from the holder body 570, forexample finger 572, are inserted into the cavities in the rigid region552, for example as also shown in FIGS. 5A-5C.

According to some exemplary embodiments, the PCB comprises at least oneadditional flexible region 574 coupled, for example electrically andmechanically coupled to the rigid region 552. In some embodiments, theat least one additional flexible region comprises at least onethermistor 576 for measuring temperature levels of the holder body 570.

Exemplary Flat PCB

According to some exemplary embodiments, the PCB, for example a rigidregion of the PCB on which the at least one energy transmitter, is flatand does not contain penetrating cavities. In some embodiments, a flatsurface of the PCB, for example a different surface of the PCB from thesurface on which the at least one energy transmitter is mounted,contacts a holder. In some embodiments, the flat surface of the PCBcontacts a flat surface of the holder. Alternatively, the flat surfaceof the PCB contacts one or more extension, for example fingers of theholder.

Reference is now made to FIGS. 6A-6B depicting an assembly between aflat surface of a PCB and a holder with extending fingers, according tosome exemplary embodiments of the invention.

According to some exemplary embodiments, PCB 602 comprises a firstsurface 604 and a second surface 606. In some embodiments, the PCB 602comprises at least one energy transmitter, for example at least twospaced-apart energy transmitters 608 and 610 mounted on the firstsurface 604. In some embodiments, the PCB 602 comprises at least onesensor, for example at least one temperature sensor 612 mounted on thefirst surface 604. In some embodiments, the at least one temperaturesensor comprises at least two temperature sensors, for examplethermistors 612 and 614. In some embodiments, the at least onetemperature sensor is configured to measure a temperature of a tissue,for example skin, contacting directly or indirectly the surface 602.

According to some exemplary embodiments, the PCB 602 is attached to aheat-conducting holder, for example holder 616 comprises a holder body618 and one or extensions, for example spaced-apart fingers 620 and 622,extending from the body 618. In some embodiments, the fingers 620 and622 contact the second surface 606, and are aligned according to theposition of the energy transmitters, for example transmitters 608 and610 on the first surface 604. In some embodiments, aligning the fingerswith the energy transmitters allows, for example, to selectively conductheat from the energy transmitters, to selectively cool the energytransmitters without thermally affecting the temperature sensors, forexample thermistor 612 positioned between two adjacent energytransmitters.

According to some exemplary embodiments, the openings, for examplespaces, between adjacent holder fingers are aligned according to aposition of the at least one sensor mounted on the first surface 604,for example sensor 612. In some embodiments, the openings between thespaced-apart fingers, for example opening 624 are filled with a thermalinsulation material, to increase thermal insulation of the at least onetemperature sensor, for example sensor 612 from the holder 616. In someembodiments, for example as shown in FIG. 6A, the openings, for exampleopening 624 is filled with air. Alternatively, for example as shown inFIG. 6B, the opening 624 is filled with an insulation materialcomprising air, Nitrogen gas, gas filled small polymer particles, gasfilled small silica particles, and/or glass fibers.

Reference is now made to FIGS. 7A-7C depicting a flat PCB comprising atleast one heat-conducting region and/or at least one thermally insulatedregion, attached to fingers of a heat-conducting holder, according tosome exemplary embodiments of the invention. In some embodiments.

According to some exemplary embodiments, for example as shown in FIG.7A, a flat surface 606 of PCB 630 is attached to fingers of aheat-conducting holder 616. In some embodiments, the PCB 630 comprisesat least one via, for example via 632 in the PCB between the holder, forexample the holder finger contacting the surface 606 and an energytransmitter, for example energy transmitter 608. In some embodiments,the via 632 formed in the PCB 630 is filled with a heat-conductingmaterial, for example Copper, Gold, Aluminum, Silver, Carbon, or amixture thereof, for example to increase heat conductivity between theholder 616 and the energy transmitter 608. In some embodiments, at least50%, for example at least 70%, at least 80%, at least 90%, at least 95%,at least 98% or any intermediate, smaller or larger percentage value ofthe via 632 volume is filled with the heat-conducting material.Optionally, the entire via 632 volume is completely filled with theheat-conducting material. In some embodiments, the via is a hole drilledthrough the PCB body. In some embodiments, the via 632 filled with theheat-conducting material is aligned with the energy transmitter and/oris laterally spaced-apart from at least one sensor, for exampletemperature sensor 612 mounted on the surface 604.

According to some exemplary embodiments, for example as shown in FIG.7B, a flat surface 606 of PCB 640 contacts a holder 616, for example tothe holder fingers. In some embodiments, the PCB 640 comprises one ormore implants, for example inserts within the PCB 640 body. In someembodiments, the one or more implants, for example implant 642 is aheat-conducting implant comprises heat-conducting material, for exampleCopper, Aluminum, Brass, Gold In some embodiments, the heat conductingimplants, for example implant 642 is positioned between the holder, forexample between a finger 620 of the holder and an energy transmitter,for example transmitter 608 mounted on the PCB. In some embodiments, theheat-conducting implant position is aligned with a position of theenergy transmitter 608 and/or is laterally spaced-apart from a sensor,for example a temperature sensor 612, mounted on the PCB 640.

According to some exemplary embodiments, the implant in the PCB bodycrosses through the PCB 640. Alternatively, the implant penetratesthrough at lets one surface of the PCB 640. Alternatively, the implantis positioned within the PCB 640 and at a distance from the PCB externalsurfaces, for example surfaces 604 and 606.

According to some exemplary embodiments, for example as shown in FIG.7C, a PCB 650 comprises at least one thermally insulated region 652, forexample a via filled with a thermally insulating material, or animplant, for example an insert filled with the thermally insulatingmaterial. In some embodiments, the at least one thermally insulatedregion 652 is positioned in the PCB 650 between the holder 616, and atleast one sensor, for example the temperature sensor 654 mounted on thesurface of the PCB 650. In some embodiments, the at least one thermallyinsulated region 652 is configured to increase thermal insulation of theat least one sensor from the holder 616. In some embodiments, thethermally insulating material comprises glass fibers.

According to some exemplary embodiments, the at least one thermallyinsulated region is aligned with the at least one sensor, and/or islaterally spaced-apart from at least one energy transmitter mounted onthe PCB 654. In some embodiments, the at least one thermally insulatedregion crosses through the PCB 650 or through at least one surface, forexample an external surface, of the PCB 650. Alternatively, the at leastone thermally insulated region is positioned within the PCB 650 at adistance from the external surfaces of the PCB 650.

According to some exemplary embodiments, for example as shown in FIG.7C, a PCB 650 comprises at least one thermally conducting region 654 andat least one thermally insulated region 652. In some embodiments, the atleast one thermally conducting region is aligned with the position ofthe energy transmitter 608 and/or is laterally spaced apart from the atleast one sensor 654, for example as described in FIGS. 7A and 7B withrespect to via 632 and implant 642, respectively.

Reference is now made to FIGS. 8A-8D, depicting a PCB having a flatsurface contacting a flat surface of a holder, for example aheat-conducting holder, according to some exemplary embodiments of theinvention.

According to some exemplary embodiments, for example as shown in FIG.8A, the PCB 602, previously shown in FIGS. 6A and 6B is placed incontact with a flat surface 802 of a holder 804.

According to some exemplary embodiments, for example as shown in FIG.8B, a PCB 630, previously shown in FIG. 7A, is placed in contact with aflat surface of the holder 804. In some embodiments, as described withrespect to FIG. 7A, the PCB 630 comprises at least one via 632.

According to some exemplary embodiments, for example as shown in FIG.8C, a PCB 640, previously shown in FIG. 7B, is placed in contact withthe flat surface of the holder 804. In some embodiments, as describedwith respect to FIG. 7B, the PCB 640 comprises at least one implant 642.

According to some exemplary embodiments, for example as shown in FIG.8D, a PCB 650, previously shown in FIG. 7C, is placed in contact withthe flat surface of the holder 804. In some embodiments, as describedwith respect to FIG. 7C, the PCB 650 comprises at least comprises atleast one thermally conducting region 654 and at least one thermallyinsulated region 652. Alternatively, the PCB comprises only at least onethermally insulated region 652.

Exemplary PCB With at Least One Inner Cooling Channel

According to some exemplary embodiments, a PCB comprises at least oneenergy transmitter mounted on a first surface of the PCB, and at leastone inner cooling element, for example a cooling channel, passing withinthe PCB. In some embodiments, the cooling channel is shaped and sized todeliver, for example to circulate, cooling fluid within the PCB, to cooldown the at least one energy transmitter and/or the first surface of thePCB. In some embodiments, the at least one cooling channel passesthrough at least one second surface of the PCB. Reference is now made toFIGS. 9A-9C depicting a PCB with an inner cooling element, according tosome exemplary embodiments of the invention.

According to some exemplary embodiments, PCB 902 has a first surface 904and a second surface 906. In some embodiments, the PCB 902 comprises atleast one, for example at least two energy transmitters mounted on thefirst surface 904, and at least one inner cooling element, for example acooling channel 912 passing within the PCB 902. In some embodiments, theat least one cooling channel 912 comprises a least one inlet 914 and atleast one outlet 916, optionally extending out from the PCB 902. In someembodiments, the inlet 914 and/or the outlet 916 extend through asurface which is different from the first surface 904, for examplethrough the second surface 906. Optionally, the second surface 906 isopposite to the first surface 904.

Optionally, the PCB comprises one or more heat conducting regions, forexample region 918, between the inner cooling element, for examplechannel 912 and at least one energy transmitter, for example transmitter908. In some embodiments, the region 918 at least partly or completelysurrounds the channel 912. In some embodiments, the region 918 comprisesa heat-conducting implant made from a heat-conducting material, forexample copper. In some embodiments, the heat-conducting implant isattached to the channel 912, for example to channel 912 wall.

According to some exemplary embodiments, the PCB 902 comprises aplurality of spaced-apart heat conducting implants, for example implants918 and 920, positioned between the channel 912 and the energytransmitters mounted on the surface 904, for example transmitters 908and 910. In some embodiments, the spaced-apart heat conducting elementsare aligned with the energy transmitters. Optionally, the second surface906, which is optionally a flat surface, contacts a heat-conductingholder 922, for example a flat surface of the holder 922.

According to some exemplary embodiments, for example as shown in FIG.9B, a PCB 924 comprises at least one cooling channel 926, passing withinthe PCB 924. In some embodiments, at least one heat-conducting implantis positioned between the channel 926 and a surface 928 on which energytransmitters are positioned. In some embodiments, the at least oneheat-conducting implant has a polygonal, oval, or round cross-section.Optionally, the at least one heat-conducting implant has a rectanglecross section, for example implant 930, or a cross-section of a square,for example implant 932, or a cross-section of a trapezoid, for exampleimplant 934.

According to some exemplary embodiments, the heat-conducting implant,for example implant 936, is in contact with channel 926 and isspaced-apart from the surface 928. Alternatively, the heat-conductingimplant, for example implant 930, is in contact with the surface 928 andis spaced-apart from the channel 926. Alternatively, the heat-conductingimplant, for example implant 932 is in contact with both the channel 926and the surface 928. Alternatively, the heat-conducting implant, forexample implant 938 is spaced-apart from both the surface 928 and thechannel 926.

According to some exemplary embodiments, for example as shown in FIG.9C, a cooling channel has a polygonal cross section, an oval crosssection or a round cross section. In some embodiments, the coolingchannel, for example cooling channel 940 has a rectangle cross section.In some embodiments, the cooling channel, for example cooling channel942 has a cross-section of a rhombus.

According to some exemplary embodiments, for example as shown in FIG.9C, a cooling channel, for example cooling channel 940 is at leastpartly surrounded by a heat-conducting implant 944, which optionallycontacts the cooling channel 940 wall. Additionally, the PCB 946 furthercomprises at least one heat conducting implant, for example implant 948between the channel, for example channel 940 and the surface 950 onwhich at least one energy transmitter is mounted.

According to some exemplary embodiments, in a similar way to thedescription of the heat conducting implants, in FIGS. 9A-9C, the PCBcomprises at least one thermal insulating implant that is optionallyshaped and sized as the heat conducting implants described in FIGS.9A-9C.

Exemplary Energy-Emitting Assembly With an Inner Cooling Element

Reference is now made to FIGS. 10A-10C, depicting an energy-emittingassembly, which comprises a PCB with an inner cooling element, accordingto some exemplary embodiments of the invention.

According to some exemplary embodiments, for example as shown in FIG.10A, an energy emitting assembly 1002 comprising a PCB 1004 having afirst surface 1006 and a second surface 1008, optionally an oppositesurface, and at least one inner cooling element, for example cooingchannel 1010 passing within the PCB 1004. In some embodiments, theassembly 1002 comprises at least one energy emitting transmitter, forexample ultrasound transducers 1012 and 1014, mounted on the firstsurface 1006 via an electrically conducting pad, for example pads 1016and 1018 attached to the first surface 1006, and optionally anelectrically conductive film, for example films 1020 and 1022 disposedbetween the pads and the transducers.

According to some exemplary embodiments, the assembly 1002 comprises atleast one heat conducting element between the channel 1010 and the firstsurface 1006. In some embodiments, the at least one heat conductingelement comprises a heat conducting implant, for example implant 1024,positioned within the PCB 1004 between the channel 1010 and the surface1006. Optionally, the implant 1024 is spaced apart from the surface 1006and/or the channel 1010. In some embodiments, the heat conductingelement comprises a VIA 1026 filled with a heat-conducting material,crosses the PCT between the first surface 1006 and the second surface1008. In some embodiments, the heat conducting element comprises a VIA1028 filled with a heat-conducting material, and positioned betweenchannel 1010 and the first surface 1006. In some embodiments, the VIA1028 crosses through the first surface and is spaced-apart from thechannel 1010.

According to some exemplary embodiments, the heat conducting elements,for example the implants 1024, the VIA 1026 and the VIA 1028, arealigned with at least one of the pads 1016 and 1018, and/or the positionof the energy transmitters 1012 and 1014.

According to some exemplary embodiments, for example as shown in FIG.10B, an energy emitting assembly 1042 comprising a PCB 1004 having afirst surface 1046 and a second surface 1048, optionally an oppositesurface, and at least one inner cooling element, for example cooingchannel 1010 passing within the PCB 1044. In some embodiments, theassembly 1042 comprises at least one energy emitting transmitter, forexample ultrasound transducers 1012 and 1014, mounted on the firstsurface 1046 via an electrically conducting pad, for example pads 1016and 1018 attached to the first surface 1006, and optionally anelectrically conductive film, for example films 1020 and 1022 disposedbetween the pads and the transducers.

According to some exemplary embodiments, the assembly 1042 furthercomprises at least one temperature sensor 1050, mounted on the firstsurface 1006 via electrically conducting pads 1052 attached to the firstsurface 1006.

According to some exemplary embodiments, the assembly 1042 comprises atleast one heat conducting element between the channel 1010 and the firstsurface 1006. In some embodiments, the at least one heat conductingelement comprises a heat conducting implant, for example implant 1024,positioned within the PCB 1044 between the channel 1010 and the firstsurface 1046. Optionally, the implant 1024 is spaced apart from thesurface 1046 and/or from the channel 1010. In some embodiments, theassembly 1042 comprises at least one thermally insulating element, forexample a thermal insulator 1054, positioned within the PCB 1044 betweenthe channel 1010 and the pads 1052 and/or the temperature sensor 1050.

According to some exemplary embodiments, the thermal insulator 1054 isaligned with the position of the at least one temperature sensor 1050 onthe first surface 1046 of the PCB 1044.

According to some exemplary embodiments, for example as shown in FIG.10C, an energy emitting assembly 1060 comprising a PCB 1064 having afirst surface 1066 and a second surface 1068, optionally an oppositesurface, and at least one inner cooling element, for example cooingchannel 1010 passing within the PCB 1064. In some embodiments, theassembly 1060 comprises at least one cooling element, for examplethermoelectric coolers (TECs) 1074 and 1076, attached to the firstsurface 1066. In some embodiments, the TECs are spaced-apart on thefirst surface 1066. In some embodiments, the assembly 1060 comprises atleast one energy emitting transmitter, for example ultrasoundtransducers 1012 and 1014, mounted on the first surface 1066 via anelectrically conducting pad, for example pads 1070 and 1072, each isattached to a surface of a different TEC of TECs 1074 and 1076, andoptionally an electrically conductive film, for example films 1020 and1022 disposed between the pads and the transducers. In some embodiments,each pf the pads, for example pads 1020 and 1022 is attached to a coldsurface of the TEC, for example TECs 1074 and 1076. In some embodiments,a hot surface of each TEC is attached to the first surface 1066 of thePCB 1064.

According to some exemplary embodiments, the assembly 1042 furthercomprises at least one heat conducting element between the channel 1010and the first surface 1006, and at least one TEC, for example a hotsurface of the TEC, for example TEC 1076. In some embodiments, the atleast one heat conducting element comprises a heat conducting implant,for example implant 1024, positioned within the PCB 1044 between thechannel 1010 and the first surface 1066 and the TEC 1076.

According to some exemplary embodiments, the cooling channel 1010, forexample as shown in FIGS. 10A-10C comprises at least one inlet 1021 andat least one outlet 1023, passing through the second surface of the PCB.

According to some exemplary embodiments, several cooling elements, forexample a plurality of cooling elements pass within the PCB. In someembodiments, each cooling channel of the plurality of cooling channel isaligned with a single energy transmitter on the PCB, for example toindividually cool a specific energy transmitter. Alternatively, a singlecooling channel of the plurality of cooling channels is aligned with twoor more energy transmitters, for example to cool the two or more energytransmitters.

A potential advantage of having several cooling channel and optionallyan individual cooling channel for each energy transmitter may be toallow a more efficient and/or uniform cooling process of all the energytransmitters on the PCB.

Exemplary Energy Emitting Assembly

Reference is now made to FIGS. 11A-11G depicting an energy-emittingassembly, according to some exemplary embodiments of the invention.

According to some exemplary embodiments, for example as shown in FIG.11A, a PCB 1102 comprises at least one first rigid region 1104 whichincludes at least one energy transmitter, for example at least oneultrasound transducer 1106, and a at least one second rigid region 1106,interconnected mechanically and/or electrically, by a flexible region1110. In some embodiments, the at least one ultrasound transducer 1106is mounted on a first surface of the at least one first rigid region1104. In some embodiments, at least one sensor, for example atemperature sensor 1112 is mounted on the first surface.

According to some exemplary embodiments, for example as shown in FIG.11B, the at least one first rigid region 1104 is placed in contact withat least one cooling element, for example a heat-conductive holder 1114.In some embodiments, a second surface of the at least one rigid region1104 which is different from the surface on which the at least oneultrasound transducer is mounted, is in contact with the holder 1114. Insome embodiments, at least part of the holder 1114 is in contact with atleast one additional cooling element, for example a TEC and/or a heatexchanger. Optionally, at least part of the holder is in contact with acold surface of a TEC, and a hot surface of the TEC is in contact withthe heat exchanger. Alternatively, the second surface of the at leastone rigid region 1104 is in contact with the heat exchanger.

According to some exemplary embodiments, for example as shown in FIGS.11C and 11E, a cover 1118 is placed on top the PCB. In some embodiments,the rigid region 1104 extends through an opening of the cover 1118. Insome embodiments, the cover 1118 is a cover of an applicator, forexample an ultrasound applicator. In some embodiments, the cover 1118surrounds the PCB and the holder 1114, for example to close gaps betweenthe holder and the rigid region of the PCB from penetration of externalelement. Additionally or alternatively, the cover 1118 providesmechanical support to the energy transmitting assembly 1102.

According to some exemplary embodiments, the cover 1118 geometricallyinterlocks with the PCB, for example with the rigid region 1104 of thePCB.

According to some exemplary embodiments, for example as shown in FIGS.11D and 11E, the rigid region 1104 and the at least one ultrasoundtransducer are covered with at least one coating layer 1120, for examplean insulating layer, configured to seal the rigid region 1104 and the atleast one ultrasound transducer from fluids and/or humidity. In someembodiments, the at least one coating layer comprises a sealing layer,for example a Parylene and optionally Paylene C, sealing layer.Alternatively or additionally, the at least one coating layer comprisesan electrical insulation material, for example Kapton. In someembodiments, for example as shown in FIG. 11D, the coating layer 1120 isplaced on top the cover 1118, for example on top or distally an openingin the cover through which the at least one ultrasound transducer isexposed.

According to some exemplary embodiments, for example as shown in FIGS.11F and 11G, the rigid region 1104 of the PCB is placed on top a holderhaving one or more extensions or fingers, for example finger 1122. Insome embodiments, at least some of the fingers or each finger, isaligned with a position of at least one ultrasound transducer, forexample transducer 1106, mounted on the rigid region 1104. In someembodiments, at least some of the fingers or each finger, penetratesinto the rigid region 1104 via a cavity in the PCB, as previouslydescribed in FIGS. 4A-4F. Alternatively, the rigid region 1104 is pacedon the fingers.

According to some exemplary embodiments, for example as shown in FIGS.11G and 11H, at least one flexible region, for example flexible strip1126 is mechanically and electrically coupled to the rigid region 1104.In some embodiments, the flexible strip 1126 comprises a temperaturesensor, for example a thermistor, for measuring the temperature of theholder. In some embodiments, the flexible strip 1126 is configured tobend and to place the thermistor is contact with the holder 1114, forexample within an opening 1128 in the holder 1126.

Exemplary PCB and Transmitter Electrical Wiring

Reference is now made to FIGS. 12A-12D depicting electrical wiringbetween a PCB and electrodes of an ultrasound transducer, for exampleelectrodes attached to a piezoelectric element of the ultrasoundtransducer, according to some exemplary embodiments of the invention.

According to some exemplary embodiments, a piezoelectric element, forexample PZT 1202 comprises at least one first electrode 1204, forexample a distal electrode, located at a distance from a PCB 1206, andat least one second electrode 1208, for example a proximal electrodelocated closer to the PCB 1206. In some embodiments, anelectrical-conductive pad 1210 is attached to the PCB 1206.Additionally, the pad 1210 is attached to the proximal electrode 1208 byan electrical conductive adhesive material 1212, for example glue. Insome embodiments, the adhesive 1212 comprises a plurality of electricalconductive particles within a non-conductive glue matrix. In someembodiments, the pad 1210 is formed from an electrical conductive metal,for example, copper, silver, gold, aluminum or any combination thereof.

According to some exemplary embodiments, for example as shown in FIG.12A, electricity is conducted from the pad 1210 to the proximalelectrode via the adhesive 1212. In some embodiments, the PCB 1206comprises a flexible region, for example flexible strip 1214 compriseselectrical wiring. In some embodiments, the flexible strip 1214electrically connects the distal electrode 1204 and the PCB 1206electrical wiring.

According to some exemplary embodiments, for example as shown in FIG.12B, as in FIG. 12A, electricity is delivered to the proximal electrode1206 from the pad 1210 via the adhesive 1212. In some embodiments, thePCB comprises a second pad 1216, which is electrically coupled to thedistal electrode 1204 via wire bonding 1218 for example with Silver orGold or Aluminum wires.

According to some exemplary embodiments, for example as shown in FIG.12C, a first electrode 1220 of the PCB 1202 is electrically connected tothe PCB 1206 by a first flexible region, for example a first flexiblestrip 1222. In some embodiments, the first flexible strip is optionallycoupled to the first electrode 1220 by soldering. In some embodiments, asecond electrode 1224 of the PCB 1202 is electrically connected to thePCB 1206 by a second flexible region, for example a second flexiblestrip 1226.

According to some exemplary embodiments, for example as shown in FIG.12D, a first electrode of the PZT 1202 is electrically connected to afirst pad 1230, via adhesive. Additionally, a second electrode 1232 ofthe PZT 1202 is electrically connected to a second pad 1234 of the PCB1206, via separate region of adhesive 1212.

FIGS. 12E and 12F provide additional examples of electrical connectionbetween electrical conductive pads 1250 of a PCB 1248 and at least oneelectrode 1252 of a piezoelectric element. In some embodiments, in A theconductive pad 1250 is electrically coupled to the electrode 1252 bywire bonding, for example using gold wires. Alternatively oradditionally, in B the conductive pad 1250 is electrically coupled tothe electrode 1252 by welding, for example gap welding. In someembodiments, the gap welding is performed using at least one silverstrip.

Exemplary Electrical Insulation of PCB Connectors

Reference is now made to FIGS. 13A-13C, depicting selective insulationof PCB electrical connectors, according to some exemplary embodiments ofthe invention.

According to some exemplary embodiments, for example as shown in FIG.13A, a rigid region 1302 of a PCB, for example an applicator PCB, iscoupled and is electrically connected to a second rigid region 1304 of aPCB, for example an energy transmitters PCB, via flexible region 1306.In some embodiments, electrical wiring within the flexible region 1306electrically interconnect wiring of the applicator PCB 1302 whichoptionally comprises at least one electrical connector 1308, and wiringof the energy transmitters PCB 1304. In some embodiments, the at leastone connector 1308, is electrically connectable to an electric braid1310 which is electrically connectable to a control unit of theapplicator.

According to some exemplary embodiments, the at least one connector 1308is surrounded by a barrier 1312 defining an insulation region 1314 whichincludes the at least one connector 1308. In some embodiments, thebarrier 1312 is configured to trap an insulating material within theboundaries of the insulating region 1314. In some embodiments, theinsulation material comprises a self-hardening material, for example agel.

According to some exemplary embodiments, for example as shown in FIG.14C, an insulating material 1320 is placed within the barrier 1312.

Exemplary Applicator

Reference is now made to FIGS. 14A-14C, depicting an applicator,according to some exemplary embodiments of the invention.

According to some exemplary embodiments, applicator 1402 comprises atleast one energy transmitter, for example ultrasound transducers 1404and 1406 mounted on a surface 1408 of a PCB 1410. In some embodiments,the applicator 1402 comprises at least one cooling element associatedwith the PCB 1410 via a surface 1412 which is different from the surface1408 on which the transducers 1404 and 1406 are mounted.

According to some exemplary embodiments, the at least one coolingelement comprises at least one cooling channel 1414, passing within thePCB 1410 and is functionally coupled to at least one pump 1416, forexample via at least one inlet channel 1418 and/or at least one outletchannel 1420. In some embodiments, the at least one pump 1416 isconfigured to circulate cooling fluid within the cooling channel 1414,for example to cool the ultrasound transducers 1404 and 1406, and/ortissue contacting the surface 1408 directly or indirectly via at leastone insulation layer. In some embodiments, the PCB 1410 comprises atleast one heat-conducting region 1422 between each or at least some ofthe ultrasound transducers 1404 and 1406, and the cooling channel 1414.

According to some exemplary embodiments, an applicator comprises aplurality of energy transmitting sub-assemblies, for example as shown inFIG. 14B.

According to some exemplary embodiments, each energy transmittingsub-assembly, for example sub-assembly 1424 comprises the PCB 1410 withthe transducers 1404 and 1406, and the cooling channel, for example asdescribed in FIG. 14A.

According to some exemplary embodiments, an applicator 1430 comprises aplurality units of sub-assembly 1424, arranged side-by-side, next to askin contacting surface of the applicator 1430, facing and/or placed incontact with tissue. In some embodiments, the plurality sub-assembliesare coupled to at least one central cooling element of the applicator,for example a pump 1432 configured to circulate cooling fluid througheach assembly 1424 of the plurality of assemblies. Additionally oralternatively, each assembly is air cooled using at least one fan.

According to some exemplary embodiments, a number of sub-assembliesand/or an arrangement of the sub-assemblies within an applicator isdetermined according to specific cosmetic or therapeutic application.Alternatively or additionally, a number of sub-assemblies and/or anarrangement of the sub-assemblies within an applicator is determinedaccording to the type of the treated tissue and/or the anatomy of thetissue.

PCB With Multi-Energy Modalities

According to some exemplary embodiments, an energy-emitting assemblycomprises a PCB, and at least two types of energy transmitters arecoupled to the PCB surface. A potential advantage of having more thanone type of energy transmitter may be to allow a wider range of therapyby treating different types of tissues and/or at different depth in thetissue, each by a different type of energy transmitter. Reference is nowmade to FIG. 15 , depicting an energy emitting assembly with differenttypes of energy transmitters, according to some exemplary embodiments ofthe invention.

According to some exemplary embodiments, assembly 1502 comprises a PCBhaving a first surface 1506 and a second surface 1508. In someembodiments, the assembly comprises at least two types of energytransmitters, for example a piezoelectric element 1510, a RF electrode1512 and/or a laser diode 1514 coupled to the first surface 1506. Insome embodiments, the second surface 1508 is associated with a coolingelement 1516, for example as previously described in FIG. 1 and in otherfigures of the application.

Exemplary PCB Wiring

Reference is now made to FIGS. 16A-16F depicting different layers of aPCB, according to some exemplary embodiments of the invention. In someembodiments, for example as shown in FIGS. 16A-16F, a PCB is formed fromseveral layers. Each figure re[resents a different layer of a PCB. Thefigures are arranged from a layer of the PCB that is a layer in a mostdistal position facing skin surface (FIG. 16A) to a most proximal layercloser to a cooling element (FIG. 16F).

According to some exemplary embodiments, each cavity, for example cavity1602, has a polygonal cross-section. Alternatively, a cavity has an ovalor a round cross-section. In some embodiments, cavity 1602 has across-section of a quadrangle, for example a rectangle, havingdimensions of at least about 2 mm X about 1 mm, for example about 4 mm Xabout 2 mm, about 5 mm X about 2 mm, about 6 mm X about 2 mm, or anyintermediate, smaller or larger dimensions.

According to some exemplary embodiments, a layer shown in FIG. 16Fcomprises copper or gold or silver or gold coated copper, or carbonfibers, in a planned location of a cavity 1602. In some embodiments,electrical wiring 1604 in layer shown in FIG. 16B, are formed from anelectric conductive material, for example copper.

As used herein with reference to quantity or value, the term “about”means “within ± 10 % of”.

The terms “comprises”, “comprising”, “includes”, “including”, “has”,“having” and their conjugates mean “including but not limited to”.

The term “consisting of” means “including and limited to”.

The term “consisting essentially of” means that the composition, methodor structure may include additional ingredients, steps and/or parts, butonly if the additional ingredients, steps and/or parts do not materiallyalter the basic and novel characteristics of the claimed composition,method or structure.

As used herein, the singular forms “a”, “an” and “the” include pluralreferences unless the context clearly dictates otherwise. For example,the term “a compound” or “at least one compound” may include a pluralityof compounds, including mixtures thereof.

Throughout this application, embodiments of this invention may bepresented with reference to a range format. It should be understood thatthe description in range format is merely for convenience and brevityand should not be construed as an inflexible limitation on the scope ofthe invention. Accordingly, the description of a range should beconsidered to have specifically disclosed all the possible subranges aswell as individual numerical values within that range. For example,description of a range such as “from 1 to 6” should be considered tohave specifically disclosed subranges such as “from 1 to 3”, “from 1 to4”, “from 1 to 5”, “from 2 to 4”, “from 2 to 6”, “from 3 to 6”, etc.; aswell as individual numbers within that range, for example, 1, 2, 3, 4,5, and 6. This applies regardless of the breadth of the range.

Whenever a numerical range is indicated herein (for example “10-15”, “10to 15”, or any pair of numbers linked by these another such rangeindication), it is meant to include any number (fractional or integral)within the indicated range limits, including the range limits, unlessthe context clearly dictates otherwise. The phrases“range/ranging/ranges between” a first indicate number and a secondindicate number and “range/ranging/ranges from” a first indicate number“to”, “up to”, “until” or “through” (or another such range-indicatingterm) a second indicate number are used herein interchangeably and aremeant to include the first and second indicated numbers and all thefractional and integral numbers therebetween.

Unless otherwise indicated, numbers used herein and any number rangesbased thereon are approximations within the accuracy of reasonablemeasurement and rounding errors as understood by persons skilled in theart.

It is appreciated that certain features of the invention, which are, forclarity, described in the context of separate embodiments, may also beprovided in combination in a single embodiment. Conversely, variousfeatures of the invention, which are, for brevity, described in thecontext of a single embodiment, may also be provided separately or inany suitable subcombination or as suitable in any other describedembodiment of the invention. Certain features described in the contextof various embodiments are not to be considered essential features ofthose embodiments, unless the embodiment is inoperative without thoseelements.

Although the invention has been described in conjunction with specificembodiments thereof, it is evident that many alternatives, modificationsand variations will be apparent to those skilled in the art.Accordingly, it is intended to embrace all such alternatives,modifications and variations that fall within the spirit and broad scopeof the appended claims.

It is the intent of the applicant(s) that all publications, patents andpatent applications referred to in this specification are to beincorporated in their entirety by reference into the specification, asif each individual publication, patent or patent application wasspecifically and individually noted when referenced that it is to beincorporated herein by reference. In addition, citation oridentification of any reference in this application shall not beconstrued as an admission that such reference is available as prior artto the present invention. To the extent that section headings are used,they should not be construed as necessarily limiting. In addition, anypriority document(s) of this application is/are hereby incorporatedherein by reference in its/their entirety.

In addition, any priority document(s) of this application is/are herebyincorporated herein by reference in its/their entirety.

What is claimed is:
 1. An energy transmitting assembly unit, comprising:a plurality of ultrasound transducers; a thin circuit board having afirst surface and a second surface and a thickness in a range between0.5 and 3 mm, wherein said plurality of ultrasound transducers aremounted on said first surface; wherein said thin circuit boardcomprises: electrical wiring in or on said thin circuit board coupled toeach of said plurality of ultrasound transducers; a plurality of heatconducting regions in said thin circuit board positioned between saidfirst surface and said second surface, wherein each of said plurality ofheat conducting regions is aligned with at least one ultrasoundtransducer of said plurality of ultrasound transducers mounted on saidfirst surface and is positioned to selectively increase heatconductivity from said at least one ultrasound transducer through thethin circuit board; wherein said plurality of heat conducting regionsand/or said second surface are configured to be coupled to a coolingelement.
 2. An assembly unit according to claim 1, wherein at least someof said plurality of heat conducting regions are filled at least partlywith a heat conducting material.
 3. An assembly unit according to claim2, wherein said heat conducting material comprises at least one of,Copper, Gold, Silver, Silver Epoxy and Gold Epoxy.
 4. An assembly unitaccording to claim 1, wherein each of said plurality of heat conductingregions in said circuit board is aligned and extends towards a singleultrasound transducer of said plurality of ultrasound transducers onsaid first surface.
 5. An assembly unit according to claim 1, whereineach of said plurality of heat conducting regions extends along at least50% of a thickness of said thin circuit board.
 6. An assembly unitaccording to claim 1, wherein said plurality of heat conducting regionscomprise a plurality of cavities extending from said second surfacethrough the thin circuit board towards said plurality of ultrasoundtransducers, and wherein each of said plurality of cavities is shapedand sized to receive a portion of said cooling element.
 7. An assemblyunit according to claim 6, comprising said cooling element, and whereinsaid cooling element comprises a heat conducting base holder having atleast one extension which is shaped and sized to penetrate into at leastone cavity of said plurality of cavities when said thin circuit board iscoupled to said cooling element.
 8. An assembly unit according to claim7, wherein said heat conducting base holder comprises a plurality ofextensions shaped as fingers, wherein each of said plurality ofextensions is shaped and sized to penetrate into a cavity of a singlecavity of said plurality of cavities.
 9. An assembly unit according toclaim 8, wherein each of said plurality of cavities comprises athermally conductive filler material configured to fill gaps betweeneach extension and the thin circuit board.
 10. An assembly unitaccording to claim 6, wherein said plurality of cavities comprisechannels configured to circulate cooling fluid from said cooling elementwithin said thin circuit board.
 11. An assembly unit according to claim1, comprising at least one temperature sensor mounted on said firstsurface between two ultrasound transducers of said plurality ofultrasound transducers.
 12. An assembly unit according to claim 11,wherein said electrical wiring of said thin circuit board iselectrically connected to said at least one temperature sensor.
 13. Anassembly unit according to claim 11, wherein said thin circuit boardcomprises at least one thermally insulated region positioned inside saidcircuit board between at least two heat conducting regions of saidplurality of heat conducting regions, and is aligned with said at leastone temperature sensor.
 14. An assembly unit according to claim 13,wherein said at least one thermally insulated region comprises anopening filled with thermal insulating material or an implant of thermalinsulating material.
 15. An assembly unit according to claim 14, whereinsaid thermal insulating material comprises at least one of, air, gas,glass fibers, silica particles with air.
 16. An assembly unit accordingto claim 1, wherein said circuit board comprises anelectrical-conducting pad on said first surface for each of saidplurality of ultrasound transducers, and wherein each of said pluralityof ultrasound transducers is coupled to said electrical-conducting padvia an electrical conductive glue.
 17. An assembly unit according toclaim 16, wherein said electrical conductive glue comprises a pluralityof electrical conductive particles within a non-conductive glue matrix.18. An assembly unit according to claim 1, wherein said plurality ofultrasound transducers are thin ultrasound transducers arranged as anarray on said first surface of said thin circuit board.
 19. An assemblyunit according to claim 1, wherein said thin circuit board comprisesthermally insulating regions in said thin circuit board and between saidplurality of heat conducting regions.
 20. An assembly unit according toclaim 19, wherein said thermally insulating regions comprises an openingfilled with thermal insulating material or an implant of thermalinsulating material.
 21. An assembly unit according to claim 1, whereinsaid thin circuit board is a rigid and thin printed circuit board formedfrom layers, and wherein said first surface and/or said second surfaceare planar.
 22. A method for manufacturing of an energy transmittingassembly unit, comprising: providing a thin rigid circuit board havingelectrical wiring, a first surface and a second surface, and a thicknessin a range between 0.5 and 3 mm, wherein said first surface comprisespredetermined locations for positioning of ultrasound transducers;mounting at least two ultrasound transducers at said predeterminedlocations on said first surface, and at a distance from each other. 23.A method according to claim 22, comprising forming at least two heatconducting regions in said thin rigid circuit board between saidpredetermined locations and said second surface, wherein each of said atleast two heat conducting regions is aligned with at least oneultrasound transducer of said at least two ultrasound transducers, andis positioned in said thin rigid circuit board to selectively increaseheat conductivity from said at least one ultrasound transducer throughthe thin rigid circuit board.
 24. A method according to claim 23,wherein said forming at least two heat conducting regions comprises,forming at least two openings in said circuit board between saidpredetermined locations on said first surface and said second surface,and introducing a heat conducting solid implant formed from a heatconducting material into said openings.
 25. A method according to claim22, comprising forming at least two cavities in said rigid circuitboard, wherein each cavity has an opening in said second surface, andextends at least partly from said second surface into said rigid circuitboard and towards a single predetermined location of said predeterminedlocations on said first surface.
 26. A method according to claim 22,wherein said mounting comprises mounting at least one temperature sensoron said first surface between said at least two ultrasound transducers.27. A method according to claim 23, wherein said forming comprisesforming at least one thermal insulating region between said at least twoheat conducting regions, and between said first surface and said secondsurface of said rigid circuit board.
 28. A method according to claim 22,wherein said mounting comprises mounting said at least two ultrasoundtransducers on said first surface using a pick and place process, at adistance in a range between 0.5 and 20 mm therebetween.
 29. A methodaccording to claim 28, comprising: placing an electrically conductingpad at each of said predetermined locations on said first surface,wherein said electrically conducting pad is attached to said firstsurface by an electrically conducting adhesive, and wherein saidmounting comprises mounting an ultrasound transducers of said at leasttwo ultrasound transducers on said electrically conducting pad.
 30. Amethod according to claim 22, wherein said rigid circuit board is aprinted circuit board (PCB) formed from layers.